Electronic package structure and fabrication method thereof

An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tsai, Chi-Pin, Chiu, Chih-Hsien, Lin, Tsung-Li, Shih, Chih-Yuan, Lin, Chien-Cheng, Chu, Heng-Cheng, Chang, Yueh-Chiung, Tsai, Tsung-Hsien, Tsai, Ming-Fan
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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