Heating and cooling device
A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the me...
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creator | Igarashi, Yoshio Takeuchi, Masaki Momose, Masahiro Wada, Takenori Matsushita, Takeshi Naruse, Mitsuhiro Kikuchi, Masahiro Yokoyama, Shoji Nakahara, Hiroaki |
description | A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10583510B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10583510B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10583510B23</originalsourceid><addsrcrecordid>eNrjZJDySE0sycxLV0jMS1FIzs_PAbFTUssyk1N5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChgamFsamhgZORMTFqACzrItE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heating and cooling device</title><source>esp@cenet</source><creator>Igarashi, Yoshio ; Takeuchi, Masaki ; Momose, Masahiro ; Wada, Takenori ; Matsushita, Takeshi ; Naruse, Mitsuhiro ; Kikuchi, Masahiro ; Yokoyama, Shoji ; Nakahara, Hiroaki</creator><creatorcontrib>Igarashi, Yoshio ; Takeuchi, Masaki ; Momose, Masahiro ; Wada, Takenori ; Matsushita, Takeshi ; Naruse, Mitsuhiro ; Kikuchi, Masahiro ; Yokoyama, Shoji ; Nakahara, Hiroaki</creatorcontrib><description>A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200310&DB=EPODOC&CC=US&NR=10583510B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200310&DB=EPODOC&CC=US&NR=10583510B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Igarashi, Yoshio</creatorcontrib><creatorcontrib>Takeuchi, Masaki</creatorcontrib><creatorcontrib>Momose, Masahiro</creatorcontrib><creatorcontrib>Wada, Takenori</creatorcontrib><creatorcontrib>Matsushita, Takeshi</creatorcontrib><creatorcontrib>Naruse, Mitsuhiro</creatorcontrib><creatorcontrib>Kikuchi, Masahiro</creatorcontrib><creatorcontrib>Yokoyama, Shoji</creatorcontrib><creatorcontrib>Nakahara, Hiroaki</creatorcontrib><title>Heating and cooling device</title><description>A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDySE0sycxLV0jMS1FIzs_PAbFTUssyk1N5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChgamFsamhgZORMTFqACzrItE</recordid><startdate>20200310</startdate><enddate>20200310</enddate><creator>Igarashi, Yoshio</creator><creator>Takeuchi, Masaki</creator><creator>Momose, Masahiro</creator><creator>Wada, Takenori</creator><creator>Matsushita, Takeshi</creator><creator>Naruse, Mitsuhiro</creator><creator>Kikuchi, Masahiro</creator><creator>Yokoyama, Shoji</creator><creator>Nakahara, Hiroaki</creator><scope>EVB</scope></search><sort><creationdate>20200310</creationdate><title>Heating and cooling device</title><author>Igarashi, Yoshio ; Takeuchi, Masaki ; Momose, Masahiro ; Wada, Takenori ; Matsushita, Takeshi ; Naruse, Mitsuhiro ; Kikuchi, Masahiro ; Yokoyama, Shoji ; Nakahara, Hiroaki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10583510B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Igarashi, Yoshio</creatorcontrib><creatorcontrib>Takeuchi, Masaki</creatorcontrib><creatorcontrib>Momose, Masahiro</creatorcontrib><creatorcontrib>Wada, Takenori</creatorcontrib><creatorcontrib>Matsushita, Takeshi</creatorcontrib><creatorcontrib>Naruse, Mitsuhiro</creatorcontrib><creatorcontrib>Kikuchi, Masahiro</creatorcontrib><creatorcontrib>Yokoyama, Shoji</creatorcontrib><creatorcontrib>Nakahara, Hiroaki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Igarashi, Yoshio</au><au>Takeuchi, Masaki</au><au>Momose, Masahiro</au><au>Wada, Takenori</au><au>Matsushita, Takeshi</au><au>Naruse, Mitsuhiro</au><au>Kikuchi, Masahiro</au><au>Yokoyama, Shoji</au><au>Nakahara, Hiroaki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heating and cooling device</title><date>2020-03-10</date><risdate>2020</risdate><abstract>A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
title | Heating and cooling device |
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