Chip on film package and flexible substrate thereof

Chip on film package and flexible substrate thereof

A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to for...

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Hauptverfasser: Hsieh, Chin-Tang, Lee, Chun-Te
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Hsieh, Chin-Tang
Lee, Chun-Te
description A chip on film package includes a chip and a flexible substrate having a film and a circuit layer. The circuit layer is formed on a first surface of the film and electrically connected to the chip. At least one groove is recessed on a second surface of the film. The flexible substrate is bent to form flat portions and at least one curved portion located between the flat portions when it is bonded to external electronic components. The groove is located on the curved portion and provided to protect the curved portion of the flexible substrate from breaking.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip on film package and flexible substrate thereof
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