Planarization process and apparatus

Methods and apparatus for planarization of a substrate. Material is dispensed onto the substrate that varies depending upon the substrate topography variation. A superstrate is brought into contact with the material, the material takes on a shape of the superstrate. The material is solidified. The s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LaBrake, Dwayne L, Resnick, Douglas J, Khusnatdinov, Niyaz
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!