Electromagnetic shielding of heat sinks with shape-memory alloy grounding

An apparatus for grounding a heat sink utilizing shape-memory alloy includes a printed circuit board, a logic chip, a heat sink, and a first grounding member, wherein the first grounding member is a shape-memory alloy. The apparatus further includes the logic chip electrically coupled to the printed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bielick, James D, Lewis, Theron L, Dangler, John R, Hugo, Stephen M, Bennett, Jennifer, Younger, Timothy P, Braun, David J
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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