Dielectric composite and uses thereof

A dielectric composite is provided. The dielectric composite comprises: at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than -150 ppm/DEG C, and the second dielectric...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Liu, Shur-Fen, Hung, Chin-Hsien, Yang, Wei-Jung, Liu, Chang-Chih
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A dielectric composite is provided. The dielectric composite comprises: at least one first dielectric layer; and at least one second dielectric layer, wherein the first dielectric layer has a thermal coefficient of dielectric constant (TCDk) not higher than -150 ppm/DEG C, and the second dielectric layer has a TCDK not lower than 50 ppm/DEG C; and the dielectric composite has a dielectric constant (Dk) not lower than 4, and a TCDk ranging from 0 to -150 ppm/DEG C.