Adhesive with tailorable electrical conductivity for monitoring mechanical properties of adhesive joint within polymeric composites

A functionalized adhesive and systems and methods employing the same are disclosed. The functionalized adhesive is configured to form an adhesive joint between a first substrate and a second substrate. The functionalized adhesive comprises a neat adhesive selected to have a bonding strength above a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Gergely, Ryan, Wagner, Sean R, Newcomb, Bradley A, Sankavaram, Chaitanya, Huang, Xiaosong, Irish, Nicholas P, Hector, Jr., Louis G
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES PRINTED CIRCUITS TESTING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A functionalized adhesive and systems and methods employing the same are disclosed. The functionalized adhesive is configured to form an adhesive joint between a first substrate and a second substrate. The functionalized adhesive comprises a neat adhesive selected to have a bonding strength above a predetermined bonding threshold and a filler selectively dispersed within the neat adhesive. The filler is selected to modify electrical properties of the neat adhesive such that the functionalized adhesive is electrically conductive with a tailored resistivity and such that a resistance of the adhesive joint is greater than a resistance of the first substrate and the second substrate.