Ultrasonic probe and method of manufacturing the same

An ultrasonic probe includes a connection layer including a conductor array for connecting a transducer array and a printed circuit board (PCB) to an application specific integrated circuit (ASIC). The ultrasonic probe includes a transducer array which transmits and receives an ultrasonic wave, a fi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lee, Jong Mok, Cho, Young Mun, Gu, Jin Ho, Kim, Jae-Yk
Format: Patent
Sprache:eng
Schlagworte:
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