Microelectronic package structures including redistribution layers

A package structure and a method for fabricating thereof are provided. The package structure includes a substrate, a first connector, a redistribution layer, a second connector, and a chip. The first connector is disposed over the substrate. The redistribution layer is directly disposed over the fir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Shih, Shing-Yih, Shih, Neng-Tai, Chiang, Hsu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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