Ultrasound transducer and method for wafer level back face attachment

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electricall...

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Hauptverfasser:	Barrett, Jason, Da Cruz, Edouard, Malacrida, Jean Pierre, Daloz, Flavien
Format:	Patent
Sprache:	eng
Schlagworte:	DIAGNOSIS ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HUMAN NECESSITIES HYGIENE IDENTIFICATION MEDICAL OR VETERINARY SCIENCE METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS SURGERY TRANSPORTING
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creator	Barrett, Jason Da Cruz, Edouard Malacrida, Jean Pierre Daloz, Flavien
description	Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
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subjects	DIAGNOSIS ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HUMAN NECESSITIES HYGIENE IDENTIFICATION MEDICAL OR VETERINARY SCIENCE METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY PERFORMING OPERATIONS SURGERY TRANSPORTING
title	Ultrasound transducer and method for wafer level back face attachment
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