Thin-film resistor (TFR) module with top-side interconnects connected to reduced TFR ridges and manufacturing methods

A method for manufacturing a thin film resistor (TFR) module in an integrated circuit (IC) structure is provided. A TFR trench may be formed in an oxide layer. A resistive TFR layer may be deposited over the structure and extending into the trench. Portions of the TFR layer outside the trench may be...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sato, Justin, Leng, Yaojian, Stom, Greg
Format: Patent
Sprache:eng
Schlagworte:
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