Device arrangement structure assembly and test method

An assembly includes a wafer having a top wafer surface and a wafer circumference and a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view. The device arrangement structur...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liao, Chun Hao, Liu, Mingo, Chen, Chu Fu, Yean, Chiou Jun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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