Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Byun, Dae Jung, Shin, Ung Hui, Han, Pyung Hwa, Kim, Byung Ho, Choi, Joo Young
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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