Measuring method and measuring arrangement for an imaging optical system
A measurement arrangement and a method for measuring a wavefront aberration of an imaging optical system (10) of a microlithographic projection exposure apparatus. The method includes separate measurement of respective wavefront aberrations of different partial arrangements (M1; M2; M3; M1, M3) of t...
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creator | Hetzler, Jochen Stiepan, Hans-Michael Wegmann, Ulrich |
description | A measurement arrangement and a method for measuring a wavefront aberration of an imaging optical system (10) of a microlithographic projection exposure apparatus. The method includes separate measurement of respective wavefront aberrations of different partial arrangements (M1; M2; M3; M1, M3) of the optical elements. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10502545B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10502545B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10502545B23</originalsourceid><addsrcrecordid>eNrjZPDwTU0sLi3KzEtXyE0tychPUUjMSwEyYYKJRUWJeempual5JQpp-UVAWYXM3MR0kFR-QUlmcmKOQnFlcUlqLg8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstiQ8NNjQwNTAyNTF1MjImRg0AyVA0sA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Measuring method and measuring arrangement for an imaging optical system</title><source>esp@cenet</source><creator>Hetzler, Jochen ; Stiepan, Hans-Michael ; Wegmann, Ulrich</creator><creatorcontrib>Hetzler, Jochen ; Stiepan, Hans-Michael ; Wegmann, Ulrich</creatorcontrib><description>A measurement arrangement and a method for measuring a wavefront aberration of an imaging optical system (10) of a microlithographic projection exposure apparatus. The method includes separate measurement of respective wavefront aberrations of different partial arrangements (M1; M2; M3; M1, M3) of the optical elements.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; TESTING ; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES ; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&CC=US&NR=10502545B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191210&DB=EPODOC&CC=US&NR=10502545B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hetzler, Jochen</creatorcontrib><creatorcontrib>Stiepan, Hans-Michael</creatorcontrib><creatorcontrib>Wegmann, Ulrich</creatorcontrib><title>Measuring method and measuring arrangement for an imaging optical system</title><description>A measurement arrangement and a method for measuring a wavefront aberration of an imaging optical system (10) of a microlithographic projection exposure apparatus. The method includes separate measurement of respective wavefront aberrations of different partial arrangements (M1; M2; M3; M1, M3) of the optical elements.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>MEASURING</subject><subject>MEASURING ANGLES</subject><subject>MEASURING AREAS</subject><subject>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</subject><subject>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</subject><subject>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDwTU0sLi3KzEtXyE0tychPUUjMSwEyYYKJRUWJeempual5JQpp-UVAWYXM3MR0kFR-QUlmcmKOQnFlcUlqLg8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstiQ8NNjQwNTAyNTF1MjImRg0AyVA0sA</recordid><startdate>20191210</startdate><enddate>20191210</enddate><creator>Hetzler, Jochen</creator><creator>Stiepan, Hans-Michael</creator><creator>Wegmann, Ulrich</creator><scope>EVB</scope></search><sort><creationdate>20191210</creationdate><title>Measuring method and measuring arrangement for an imaging optical system</title><author>Hetzler, Jochen ; Stiepan, Hans-Michael ; Wegmann, Ulrich</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10502545B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>MEASURING</topic><topic>MEASURING ANGLES</topic><topic>MEASURING AREAS</topic><topic>MEASURING IRREGULARITIES OF SURFACES OR CONTOURS</topic><topic>MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES</topic><topic>TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>Hetzler, Jochen</creatorcontrib><creatorcontrib>Stiepan, Hans-Michael</creatorcontrib><creatorcontrib>Wegmann, Ulrich</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hetzler, Jochen</au><au>Stiepan, Hans-Michael</au><au>Wegmann, Ulrich</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Measuring method and measuring arrangement for an imaging optical system</title><date>2019-12-10</date><risdate>2019</risdate><abstract>A measurement arrangement and a method for measuring a wavefront aberration of an imaging optical system (10) of a microlithographic projection exposure apparatus. The method includes separate measurement of respective wavefront aberrations of different partial arrangements (M1; M2; M3; M1, M3) of the optical elements.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS TESTING TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR |
title | Measuring method and measuring arrangement for an imaging optical system |
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