Light emitting device

A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second pla...

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creator Miki, Tomohide
description A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10490723B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10490723B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10490723B23</originalsourceid><addsrcrecordid>eNrjZBD1yUzPKFFIzc0sKcnMS1dISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBiaWBuZGxk5GxsSoAQBwMSEt</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light emitting device</title><source>esp@cenet</source><creator>Miki, Tomohide</creator><creatorcontrib>Miki, Tomohide</creatorcontrib><description>A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191126&amp;DB=EPODOC&amp;CC=US&amp;NR=10490723B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20191126&amp;DB=EPODOC&amp;CC=US&amp;NR=10490723B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Miki, Tomohide</creatorcontrib><title>Light emitting device</title><description>A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD1yUzPKFFIzc0sKcnMS1dISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBiaWBuZGxk5GxsSoAQBwMSEt</recordid><startdate>20191126</startdate><enddate>20191126</enddate><creator>Miki, Tomohide</creator><scope>EVB</scope></search><sort><creationdate>20191126</creationdate><title>Light emitting device</title><author>Miki, Tomohide</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10490723B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Miki, Tomohide</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miki, Tomohide</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light emitting device</title><date>2019-11-26</date><risdate>2019</risdate><abstract>A light emitting device includes a resin package and a light emitting element. The resin package includes a molded resin part and a pair of leads. The molded resin part defines a part of a recessed portion. Each of the leads includes a plating layer including a first plating portion and a second plating portion. Each of the leads is exposed from the molded resin part at a lower surface of the resin package with the first plating portion being arranged in at least a part of the lead exposed at the lower surface of the resin package. Each of the leads includes an exposed portion exposed from the molded resin part at a lateral side surface of the resin package with the second plating portion being arranged in an outer periphery of the exposed portion. The light emitting element is mounted on the bottom surface of the recessed portion.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light emitting device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T16%3A09%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Miki,%20Tomohide&rft.date=2019-11-26&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10490723B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true