Light emitting device package

A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	De Jong, Boudewijn Ruben, Oberndorff, Pascal Johannes Theodorus Lambertus, Donker, Marcus Franciscus, Dijkstra, Paul, Reints Bok, Aernout, Zhang, Lu Fei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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