Two material high K thermal encapsulant system

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nagarajan, Sivakumar, Wang, Liwei, Weinman, Craig J, Ananthakrishnan, Nisha, McMahan, Venmathy, Chu, Kuang-Han, Eitan, Amram, Mallik, Amrita, Bozorg-Grayeli, Elah
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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