Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit
There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a la...
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| creator | Yoshihara, Sunao Fujikawa, Wataru Katsuta, Haruhiko Katayama, Yoshinori Murakawa, Akira Shirakami, Jun Saitou, Yukie |
| description | There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method. |
| format | Patent |
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The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.</description><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191105&DB=EPODOC&CC=US&NR=10470312B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191105&DB=EPODOC&CC=US&NR=10470312B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yoshihara, Sunao</creatorcontrib><creatorcontrib>Fujikawa, Wataru</creatorcontrib><creatorcontrib>Katsuta, Haruhiko</creatorcontrib><creatorcontrib>Katayama, Yoshinori</creatorcontrib><creatorcontrib>Murakawa, Akira</creatorcontrib><creatorcontrib>Shirakami, Jun</creatorcontrib><creatorcontrib>Saitou, Yukie</creatorcontrib><title>Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit</title><description>There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqVyrsKAjEQQNE0FqL-w9gr7EOwVxQbK7VehslkHYhJyE4EC_9dBLHW4nKbMzbPI-s1WnAxv7tJ6IE9k2Yh9P4BFIMtpHJnKF4zOgkMCVU5h8U_FIP9ciDJVESnZuTQDzz7fGLm-915e1hyih0PCYkDa3c51dVqXbV1s2naX8wLBY1JcQ</recordid><startdate>20191105</startdate><enddate>20191105</enddate><creator>Yoshihara, Sunao</creator><creator>Fujikawa, Wataru</creator><creator>Katsuta, Haruhiko</creator><creator>Katayama, Yoshinori</creator><creator>Murakawa, Akira</creator><creator>Shirakami, Jun</creator><creator>Saitou, Yukie</creator><scope>EVB</scope></search><sort><creationdate>20191105</creationdate><title>Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit</title><author>Yoshihara, Sunao ; Fujikawa, Wataru ; Katsuta, Haruhiko ; Katayama, Yoshinori ; Murakawa, Akira ; Shirakami, Jun ; Saitou, Yukie</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10470312B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Yoshihara, Sunao</creatorcontrib><creatorcontrib>Fujikawa, Wataru</creatorcontrib><creatorcontrib>Katsuta, Haruhiko</creatorcontrib><creatorcontrib>Katayama, Yoshinori</creatorcontrib><creatorcontrib>Murakawa, Akira</creatorcontrib><creatorcontrib>Shirakami, Jun</creatorcontrib><creatorcontrib>Saitou, Yukie</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yoshihara, Sunao</au><au>Fujikawa, Wataru</au><au>Katsuta, Haruhiko</au><au>Katayama, Yoshinori</au><au>Murakawa, Akira</au><au>Shirakami, Jun</au><au>Saitou, Yukie</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit</title><date>2019-11-05</date><risdate>2019</risdate><abstract>There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Method for forming electrically conductive ultrafine pattern, electrically conductive ultrafine pattern, and electric circuit |
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