Integrated two-terminal device with logic device for embedded application

Devices and methods of forming a device are disclosed. The method includes providing a substrate and a first upper dielectric layer over first and second regions of the substrate. The first upper dielectric layer includes a first upper interconnect level with a plurality of metal lines in the region...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	See, Alex, Yi, Wanbing, Hsieh, Curtis Chun-I, Yang, Hyunwoo, Siah, Soh Yun, You, Young Seon, Shum, Danny Pak-Chum, Tan, Juan Boon, Cong, Hai
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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