Arc-resistant crackstop

The present disclosure relates to semiconductor structures and, more particularly, to arc resistant crackstop structures and methods of manufacture. The structure includes: a crackstop structure comprising dual rails surrounding an active area of an integrated circuit; and a through-BOx electrical c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Polomoff, Nicholas A, McGahay, Vincent J, Yao, Shaoning, Arora, Anupam
Format: Patent
Sprache:eng
Schlagworte:
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