Temperature sensor
Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple a...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Hung, Kuohsing E Meis, Charles S |
| description | Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple and the spring housing is configured to accommodate the spring and thermocouple within the spring housing. Additionally, the spring housing is configured to attach to the reference material and the spring applies a force on the thermocouple in a direction towards the reference material. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10429248B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10429248B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10429248B23</originalsourceid><addsrcrecordid>eNrjZBAKSc0tSC1KLCktSlUoTs0rzi_iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBiZGlkYmFk5GxsSoAQAZ_CBx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Temperature sensor</title><source>esp@cenet</source><creator>Hung, Kuohsing E ; Meis, Charles S</creator><creatorcontrib>Hung, Kuohsing E ; Meis, Charles S</creatorcontrib><description>Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple and the spring housing is configured to accommodate the spring and thermocouple within the spring housing. Additionally, the spring housing is configured to attach to the reference material and the spring applies a force on the thermocouple in a direction towards the reference material.</description><language>eng</language><subject>MEASURING ; MEASURING QUANTITY OF HEAT ; MEASURING TEMPERATURE ; PHYSICS ; TESTING ; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191001&DB=EPODOC&CC=US&NR=10429248B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191001&DB=EPODOC&CC=US&NR=10429248B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hung, Kuohsing E</creatorcontrib><creatorcontrib>Meis, Charles S</creatorcontrib><title>Temperature sensor</title><description>Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple and the spring housing is configured to accommodate the spring and thermocouple within the spring housing. Additionally, the spring housing is configured to attach to the reference material and the spring applies a force on the thermocouple in a direction towards the reference material.</description><subject>MEASURING</subject><subject>MEASURING QUANTITY OF HEAT</subject><subject>MEASURING TEMPERATURE</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAKSc0tSC1KLCktSlUoTs0rzi_iYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGBiZGlkYmFk5GxsSoAQAZ_CBx</recordid><startdate>20191001</startdate><enddate>20191001</enddate><creator>Hung, Kuohsing E</creator><creator>Meis, Charles S</creator><scope>EVB</scope></search><sort><creationdate>20191001</creationdate><title>Temperature sensor</title><author>Hung, Kuohsing E ; Meis, Charles S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10429248B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>MEASURING</topic><topic>MEASURING QUANTITY OF HEAT</topic><topic>MEASURING TEMPERATURE</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>Hung, Kuohsing E</creatorcontrib><creatorcontrib>Meis, Charles S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hung, Kuohsing E</au><au>Meis, Charles S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Temperature sensor</title><date>2019-10-01</date><risdate>2019</risdate><abstract>Disclosed is a temperature sensor for measuring a temperature of a reference material. The temperature sensor includes a thermocouple, spring, and spring housing. The thermocouple is configured to measure the temperature of the reference material. The spring is operably coupled to the thermocouple and the spring housing is configured to accommodate the spring and thermocouple within the spring housing. Additionally, the spring housing is configured to attach to the reference material and the spring applies a force on the thermocouple in a direction towards the reference material.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US10429248B2 |
| source | esp@cenet |
| subjects | MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR |
| title | Temperature sensor |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T18%3A38%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hung,%20Kuohsing%20E&rft.date=2019-10-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10429248B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |