Printed circuit board with insulated metal substrate made of steel

A power electronic device includes an Insulated Metal Substrate Printed Circuit Board (IMS PCB) and a power semiconductor device package. The power semiconductor device package includes a lead frame configured to electrically and mechanically couple the power semiconductor device package to the IMS...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kahrimanovic, Elvir, Lun, Wai Keung Alan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!