Method and system for phase change material component cooling
A transient cooling system includes a first phase change material (PCM) element and a second PCM element. The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a t...
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| creator | Riaz, Shahi Intemann, Paul Alexander |
| description | A transient cooling system includes a first phase change material (PCM) element and a second PCM element. The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a third surface in thermal contact with the second surface. The first PCM and the second PCM may have different thermal characteristics. |
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The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a third surface in thermal contact with the second surface. The first PCM and the second PCM may have different thermal characteristics.</description><language>eng</language><subject>AIR INTAKES FOR JET-PROPULSION PLANTS ; BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMBUSTION ENGINES ; CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GAS-TURBINE PLANTS ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190917&DB=EPODOC&CC=US&NR=10415474B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190917&DB=EPODOC&CC=US&NR=10415474B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Riaz, Shahi</creatorcontrib><creatorcontrib>Intemann, Paul Alexander</creatorcontrib><title>Method and system for phase change material component cooling</title><description>A transient cooling system includes a first phase change material (PCM) element and a second PCM element. 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The first PCM element includes a first PCM, a first surface, and a second surface, the first surface complementary to a surface to be cooled. The second PCM element includes a second PCM and a third surface in thermal contact with the second surface. The first PCM and the second PCM may have different thermal characteristics.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AIR INTAKES FOR JET-PROPULSION PLANTS BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBUSTION ENGINES CONTROLLING FUEL SUPPLY IN AIR-BREATHING JET-PROPULSION PLANTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GAS-TURBINE PLANTS HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | Method and system for phase change material component cooling |
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