Resin molded body with RFIC package incorporated therein and method for manufacturing same

A resin molded body with an RFIC package incorporated therein is insert-molded incorporating therein a metal core material and an RFIC element connected to the metal core material. The RFIC element includes a ceramic multi-layer substrate that incorporates therein a coil conductor, and an RFIC chip...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Imanishi, Hiroyuki, Kato, Noboru
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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