Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a package substrate having first and second major surfaces. The package substrate includes a base substrate having a mold material and a plurality of interconnect structures including...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wo, Chun Hong, Yang, Yongbo, Dimaano, Antonio Jr. Bambalan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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