Multi-chip structure having flexible input/output chips
A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Yu, Chih-Ching Yin, Hao-Hui Su, Yao-Chun Luo, Yan-Bin |
description | A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10397142B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10397142B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10397142B23</originalsourceid><addsrcrecordid>eNrjZDD3Lc0pydRNzsgsUCguKSpNLiktSlXISCzLzEtXSMtJrchMyklVyMwrKC3Rzy8tAVIKILXFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPjTY0MDY0tzQxMjJyJgYNQAXJi6k</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multi-chip structure having flexible input/output chips</title><source>esp@cenet</source><creator>Yu, Chih-Ching ; Yin, Hao-Hui ; Su, Yao-Chun ; Luo, Yan-Bin</creator><creatorcontrib>Yu, Chih-Ching ; Yin, Hao-Hui ; Su, Yao-Chun ; Luo, Yan-Bin</creatorcontrib><description>A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; CODE CONVERSION IN GENERAL ; CODING ; DECODING ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES ; TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190827&DB=EPODOC&CC=US&NR=10397142B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190827&DB=EPODOC&CC=US&NR=10397142B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yu, Chih-Ching</creatorcontrib><creatorcontrib>Yin, Hao-Hui</creatorcontrib><creatorcontrib>Su, Yao-Chun</creatorcontrib><creatorcontrib>Luo, Yan-Bin</creatorcontrib><title>Multi-chip structure having flexible input/output chips</title><description>A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>CODE CONVERSION IN GENERAL</subject><subject>CODING</subject><subject>DECODING</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD3Lc0pydRNzsgsUCguKSpNLiktSlXISCzLzEtXSMtJrchMyklVyMwrKC3Rzy8tAVIKILXFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPjTY0MDY0tzQxMjJyJgYNQAXJi6k</recordid><startdate>20190827</startdate><enddate>20190827</enddate><creator>Yu, Chih-Ching</creator><creator>Yin, Hao-Hui</creator><creator>Su, Yao-Chun</creator><creator>Luo, Yan-Bin</creator><scope>EVB</scope></search><sort><creationdate>20190827</creationdate><title>Multi-chip structure having flexible input/output chips</title><author>Yu, Chih-Ching ; Yin, Hao-Hui ; Su, Yao-Chun ; Luo, Yan-Bin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10397142B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>CODE CONVERSION IN GENERAL</topic><topic>CODING</topic><topic>DECODING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>Yu, Chih-Ching</creatorcontrib><creatorcontrib>Yin, Hao-Hui</creatorcontrib><creatorcontrib>Su, Yao-Chun</creatorcontrib><creatorcontrib>Luo, Yan-Bin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yu, Chih-Ching</au><au>Yin, Hao-Hui</au><au>Su, Yao-Chun</au><au>Luo, Yan-Bin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-chip structure having flexible input/output chips</title><date>2019-08-27</date><risdate>2019</risdate><abstract>A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US10397142B2 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CODE CONVERSION IN GENERAL CODING DECODING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION |
title | Multi-chip structure having flexible input/output chips |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T13%3A34%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yu,%20Chih-Ching&rft.date=2019-08-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10397142B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |