Inspection method of laminated board, inspection module, and pallet

Inspection method of laminated board, inspection module, and pallet

A method for inspecting a laminated board, includes: performing a reflow process to solder an electronic component to a surface of a laminated board in which at least one of a plurality of wiring layers which are laminated with each other is coupled to another adjacent wiring layer via a via; and in...

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Hauptverfasser: Kitagawa, Takahiro, Abe, Mitsunori, Iriguchi, Shigeo, Hatanaka, Kiyoyuki, Sugino, Shigeru, Kanai, Ryo
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator Kitagawa, Takahiro
Abe, Mitsunori
Iriguchi, Shigeo
Hatanaka, Kiyoyuki
Sugino, Shigeru
Kanai, Ryo
description A method for inspecting a laminated board, includes: performing a reflow process to solder an electronic component to a surface of a laminated board in which at least one of a plurality of wiring layers which are laminated with each other is coupled to another adjacent wiring layer via a via; and inspecting, in the reflow process, a conduction state of the via after a temperature of the laminated board reaches a melting point of a solder, and when the temperature of the laminated board is at a temperature range lower than the melting point and higher than room temperature.
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Inspection method of laminated board, inspection module, and pallet
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