Method of inspecting wafer using electron beam

A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning t...

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Bibliographische Detailangaben
Hauptverfasser: Shin, Kwang-il, Yang, Yu-sin, Kim, Souk, Ko, Woo-seok, Lee, Sang-kil, Yoon, Min-chul, Jun, Chung-sam
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.