Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, a...
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| creator | Campanella-Pineda, Humberto Kumar, Rakesh Ranganathan, Nagarajan Sbiaa, Zouhair Yelehanka, Ramachandramurthy Pradeep |
| description | Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10358340B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10358340B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10358340B23</originalsourceid><addsrcrecordid>eNqNizEOwjAMALswIOAP5gFIhYDEDCqCoVNhrtzEaSyVpIpN3w8DKxLTDXc3L7pbVOozKjmwnO2LVSDgxLEHCUyD-4i6qhtwNLElAYwOnqQhOQGfMnjsMlvUn8eymHkchFZfLor1pbqfrxsaU0syoqVI2j6abWkOR7MvTzvzT_MGAMA9bQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices</title><source>esp@cenet</source><creator>Campanella-Pineda, Humberto ; Kumar, Rakesh ; Ranganathan, Nagarajan ; Sbiaa, Zouhair ; Yelehanka, Ramachandramurthy Pradeep</creator><creatorcontrib>Campanella-Pineda, Humberto ; Kumar, Rakesh ; Ranganathan, Nagarajan ; Sbiaa, Zouhair ; Yelehanka, Ramachandramurthy Pradeep</creatorcontrib><description>Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190723&DB=EPODOC&CC=US&NR=10358340B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190723&DB=EPODOC&CC=US&NR=10358340B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Campanella-Pineda, Humberto</creatorcontrib><creatorcontrib>Kumar, Rakesh</creatorcontrib><creatorcontrib>Ranganathan, Nagarajan</creatorcontrib><creatorcontrib>Sbiaa, Zouhair</creatorcontrib><creatorcontrib>Yelehanka, Ramachandramurthy Pradeep</creatorcontrib><title>Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices</title><description>Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizEOwjAMALswIOAP5gFIhYDEDCqCoVNhrtzEaSyVpIpN3w8DKxLTDXc3L7pbVOozKjmwnO2LVSDgxLEHCUyD-4i6qhtwNLElAYwOnqQhOQGfMnjsMlvUn8eymHkchFZfLor1pbqfrxsaU0syoqVI2j6abWkOR7MvTzvzT_MGAMA9bQ</recordid><startdate>20190723</startdate><enddate>20190723</enddate><creator>Campanella-Pineda, Humberto</creator><creator>Kumar, Rakesh</creator><creator>Ranganathan, Nagarajan</creator><creator>Sbiaa, Zouhair</creator><creator>Yelehanka, Ramachandramurthy Pradeep</creator><scope>EVB</scope></search><sort><creationdate>20190723</creationdate><title>Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices</title><author>Campanella-Pineda, Humberto ; Kumar, Rakesh ; Ranganathan, Nagarajan ; Sbiaa, Zouhair ; Yelehanka, Ramachandramurthy Pradeep</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10358340B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Campanella-Pineda, Humberto</creatorcontrib><creatorcontrib>Kumar, Rakesh</creatorcontrib><creatorcontrib>Ranganathan, Nagarajan</creatorcontrib><creatorcontrib>Sbiaa, Zouhair</creatorcontrib><creatorcontrib>Yelehanka, Ramachandramurthy Pradeep</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Campanella-Pineda, Humberto</au><au>Kumar, Rakesh</au><au>Ranganathan, Nagarajan</au><au>Sbiaa, Zouhair</au><au>Yelehanka, Ramachandramurthy Pradeep</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices</title><date>2019-07-23</date><risdate>2019</risdate><abstract>Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices |
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