Lead frame for light emitting device, and lead frame member for light emitting device

A package for a light emitting device includes a resin molding and a first lead. The resin molding defines a recess opening at the upper surface of the resin molding. The first lead includes first and second lower exposed surfaces and an upper exposed surface. The first and second lower exposed surf...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ichihara, Yoshio, Kurimoto, Takeo
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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