Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method
Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided i...
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| creator | Miyamoto, Nobuaki Kohiki, Michiya |
| description | Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure. |
| format | Patent |
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The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190709&DB=EPODOC&CC=US&NR=10349531B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190709&DB=EPODOC&CC=US&NR=10349531B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Miyamoto, Nobuaki</creatorcontrib><creatorcontrib>Kohiki, Michiya</creatorcontrib><title>Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method</title><description>Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwkAQRNNYiPoPa5-AMVrYGhR7tQ7r3SZZuNwdm1V_w082gmChhdUMjzczTh4lijBJhqpoWrJgQowkUAd2KTjs2KPSp0GUYK-GfQMdaRtsOhD2OizvLC98CSj2h4beAjkyKsGzAUs3Nt9302RUo-tp9s5JMt_vTuUhoxgq6iMa8qTV-ZgvitVmXeTbZfGP8wSPp0-I</recordid><startdate>20190709</startdate><enddate>20190709</enddate><creator>Miyamoto, Nobuaki</creator><creator>Kohiki, Michiya</creator><scope>EVB</scope></search><sort><creationdate>20190709</creationdate><title>Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method</title><author>Miyamoto, Nobuaki ; Kohiki, Michiya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10349531B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Miyamoto, Nobuaki</creatorcontrib><creatorcontrib>Kohiki, Michiya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miyamoto, Nobuaki</au><au>Kohiki, Michiya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method</title><date>2019-07-09</date><risdate>2019</risdate><abstract>Provided herein is a carrier-attached copper foil having desirable laser drillability through an ultrathin copper layer, preferred for fabrication of a high-density integrated circuit substrate. The carrier-attached copper foil includes an interlayer and an ultrathin copper layer that are provided in this order on one or both surfaces of a carrier. The surface roughness Sz and the surface roughness Sa on the interlayer side of the ultrathin copper layer satisfy Sz≤3.6 μm, and Sz/Sa≤14.00 as measured with a laser microscope in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated to an insulating substrate from the ultrathin copper layer side under a pressure of 20 kgf/cm2 and heated at 220° C. for 2 hours. GMD, which is a 60-degree glossiness of the ultrathin copper layer surface on the interlayer side in MD direction, satisfies GMD≤150 in case of detaching the carrier from the carrier-attached copper foil according to JIS C 6471 after the carrier-attached copper foil is laminated using the same procedure.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Carrier-attached copper foil, laminate, laminate producing method, printed wiring board producing method, and electronic device producing method |
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