LED package with integrated features for gas or liquid cooling

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Van Honschooten, Rene, Mehnert, Axel, Golubovic, Dusan, Donker, Marcus Franciscus, Treurniet, Theodoor Cornelis, Eggink, Hendrik Jan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!