Method of forming a semiconductor die cutting tool
In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Grivna, Gordon M Parsey, Jr., John M |
| description | In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10340160B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10340160B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10340160B23</originalsourceid><addsrcrecordid>eNrjZDDyTS3JyE9RyE9TSMsvys3MS1dIVChOzc1Mzs9LKU0uyS9SSMlMVUguLSkByZXk5-fwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDA2MTA0MzAycjY2LUAAC53iwB</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of forming a semiconductor die cutting tool</title><source>esp@cenet</source><creator>Grivna, Gordon M ; Parsey, Jr., John M</creator><creatorcontrib>Grivna, Gordon M ; Parsey, Jr., John M</creatorcontrib><description>In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; COMBINED OPERATIONS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; OTHER WORKING OF METAL ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; UNIVERSAL MACHINE TOOLS ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190702&DB=EPODOC&CC=US&NR=10340160B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190702&DB=EPODOC&CC=US&NR=10340160B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Grivna, Gordon M</creatorcontrib><creatorcontrib>Parsey, Jr., John M</creatorcontrib><title>Method of forming a semiconductor die cutting tool</title><description>In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COMBINED OPERATIONS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>OTHER WORKING OF METAL</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>UNIVERSAL MACHINE TOOLS</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDyTS3JyE9RyE9TSMsvys3MS1dIVChOzc1Mzs9LKU0uyS9SSMlMVUguLSkByZXk5-fwMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDA2MTA0MzAycjY2LUAAC53iwB</recordid><startdate>20190702</startdate><enddate>20190702</enddate><creator>Grivna, Gordon M</creator><creator>Parsey, Jr., John M</creator><scope>EVB</scope></search><sort><creationdate>20190702</creationdate><title>Method of forming a semiconductor die cutting tool</title><author>Grivna, Gordon M ; Parsey, Jr., John M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10340160B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COMBINED OPERATIONS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>OTHER WORKING OF METAL</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>UNIVERSAL MACHINE TOOLS</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>Grivna, Gordon M</creatorcontrib><creatorcontrib>Parsey, Jr., John M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Grivna, Gordon M</au><au>Parsey, Jr., John M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of forming a semiconductor die cutting tool</title><date>2019-07-02</date><risdate>2019</risdate><abstract>In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US10340160B2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS COMBINED OPERATIONS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER WORKING OF METAL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING UNIVERSAL MACHINE TOOLS WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | Method of forming a semiconductor die cutting tool |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T16%3A09%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Grivna,%20Gordon%20M&rft.date=2019-07-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10340160B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |