Electronic sandwich structure with two parts joined together by means of a sintering layer

An electronic sandwich structure which has at least a first and a second part to be joined, which are sintered together by means of a sintering layer. The sintering layer is formed as a substantially uninterrupted connecting layer, the density of which varies in such a way that at least one region o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Eisele, Ronald, Osterwald, Frank, Rudzki, Jacek, Becker, Martin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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