Micro-LED module and method for fabricating the same

Micro-LED module and method for fabricating the same

A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bon...

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Hauptverfasser: Chang, Hanbeet, Kim, Yongpil, Kim, Daewon, Yoo, Taekyung, Moon, Myungji, Yoon, Seongbok, Park, Jaesoon, Won, Yelim
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Chang, Hanbeet
Kim, Yongpil
Kim, Daewon
Yoo, Taekyung
Moon, Myungji
Yoon, Seongbok
Park, Jaesoon
Won, Yelim
description A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Micro-LED module and method for fabricating the same
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