Electronic component package and method of housing an electronic component

An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a longitudinal direction, and a second main surface that is concavely curved along the longitudinal direction, a distance between the first main...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Watabe, Masataka, Suga, Yasutomo
Format: Patent
Sprache:eng
Schlagworte:
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