Laser processing apparatus

A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a clea...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Yoshii, Shungo
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Yoshii, Shungo
description A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10315273B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10315273B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10315273B23</originalsourceid><addsrcrecordid>eNrjZJDySSxOLVIoKMpPTi0uzsxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxoamRubGTkbGxKgBAGbAI2Y</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Laser processing apparatus</title><source>esp@cenet</source><creator>Yoshii, Shungo</creator><creatorcontrib>Yoshii, Shungo</creatorcontrib><description>A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190611&amp;DB=EPODOC&amp;CC=US&amp;NR=10315273B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190611&amp;DB=EPODOC&amp;CC=US&amp;NR=10315273B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yoshii, Shungo</creatorcontrib><title>Laser processing apparatus</title><description>A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDySSxOLVIoKMpPTi0uzsxLV0gsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGxoamRubGTkbGxKgBAGbAI2Y</recordid><startdate>20190611</startdate><enddate>20190611</enddate><creator>Yoshii, Shungo</creator><scope>EVB</scope></search><sort><creationdate>20190611</creationdate><title>Laser processing apparatus</title><author>Yoshii, Shungo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10315273B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>Yoshii, Shungo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yoshii, Shungo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Laser processing apparatus</title><date>2019-06-11</date><risdate>2019</risdate><abstract>A laser processing apparatus has a suction unit for suctioning debris. The suction unit includes a debris trapping chamber and a cleaning unit for cleaning the inside of the debris trapping chamber. The cleaning unit includes a shutter for closing an opening of the debris trapping chamber and a cleaning water supply port for supplying cleaning water to the debris trapping chamber when the opening thereof is closed. The shutter closes the opening of the debris trapping chamber, the suction unit exerts a suction through the suction port, and cleaning water is supplied from the cleaning water supply port to the debris trapping chamber and suctioned through the suction port to clean the inside of the debris trapping chamber.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US10315273B2
source esp@cenet
subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Laser processing apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T23%3A18%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Yoshii,%20Shungo&rft.date=2019-06-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10315273B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true