Deposition device and deposition method
A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is c...
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| creator | Nakamura, Kanto Hirasawa, Tatsuo Gomi, Atsushi Sato, Keisuke Shimada, Atsushi Sone, Hiroshi Kitada, Toru Suzuki, Yusuke Takatsuki, Koichi Yasumuro, Chiaki Suzuki, Yasunobu Kojima, Yasuhiko |
| description | A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region. |
| format | Patent |
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A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190604&DB=EPODOC&CC=US&NR=10309005B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190604&DB=EPODOC&CC=US&NR=10309005B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nakamura, Kanto</creatorcontrib><creatorcontrib>Hirasawa, Tatsuo</creatorcontrib><creatorcontrib>Gomi, Atsushi</creatorcontrib><creatorcontrib>Sato, Keisuke</creatorcontrib><creatorcontrib>Shimada, Atsushi</creatorcontrib><creatorcontrib>Sone, Hiroshi</creatorcontrib><creatorcontrib>Kitada, Toru</creatorcontrib><creatorcontrib>Suzuki, Yusuke</creatorcontrib><creatorcontrib>Takatsuki, Koichi</creatorcontrib><creatorcontrib>Yasumuro, Chiaki</creatorcontrib><creatorcontrib>Suzuki, Yasunobu</creatorcontrib><creatorcontrib>Kojima, Yasuhiko</creatorcontrib><title>Deposition device and deposition method</title><description>A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB3SS3IL84syczPU0hJLctMTlVIzEsBMuGiuaklGfkpPAysaYk5xam8UJqbQdHNNcTZQxeoMD61uCAxOTUvtSQ-NNjQwNjA0sDA1MnImBg1ALH3KCY</recordid><startdate>20190604</startdate><enddate>20190604</enddate><creator>Nakamura, Kanto</creator><creator>Hirasawa, Tatsuo</creator><creator>Gomi, Atsushi</creator><creator>Sato, Keisuke</creator><creator>Shimada, Atsushi</creator><creator>Sone, Hiroshi</creator><creator>Kitada, Toru</creator><creator>Suzuki, Yusuke</creator><creator>Takatsuki, Koichi</creator><creator>Yasumuro, Chiaki</creator><creator>Suzuki, Yasunobu</creator><creator>Kojima, Yasuhiko</creator><scope>EVB</scope></search><sort><creationdate>20190604</creationdate><title>Deposition device and deposition method</title><author>Nakamura, Kanto ; Hirasawa, Tatsuo ; Gomi, Atsushi ; Sato, Keisuke ; Shimada, Atsushi ; Sone, Hiroshi ; Kitada, Toru ; Suzuki, Yusuke ; Takatsuki, Koichi ; Yasumuro, Chiaki ; Suzuki, Yasunobu ; Kojima, Yasuhiko</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10309005B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>Nakamura, Kanto</creatorcontrib><creatorcontrib>Hirasawa, Tatsuo</creatorcontrib><creatorcontrib>Gomi, Atsushi</creatorcontrib><creatorcontrib>Sato, Keisuke</creatorcontrib><creatorcontrib>Shimada, Atsushi</creatorcontrib><creatorcontrib>Sone, Hiroshi</creatorcontrib><creatorcontrib>Kitada, Toru</creatorcontrib><creatorcontrib>Suzuki, Yusuke</creatorcontrib><creatorcontrib>Takatsuki, Koichi</creatorcontrib><creatorcontrib>Yasumuro, Chiaki</creatorcontrib><creatorcontrib>Suzuki, Yasunobu</creatorcontrib><creatorcontrib>Kojima, Yasuhiko</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nakamura, Kanto</au><au>Hirasawa, Tatsuo</au><au>Gomi, Atsushi</au><au>Sato, Keisuke</au><au>Shimada, Atsushi</au><au>Sone, Hiroshi</au><au>Kitada, Toru</au><au>Suzuki, Yusuke</au><au>Takatsuki, Koichi</au><au>Yasumuro, Chiaki</au><au>Suzuki, Yasunobu</au><au>Kojima, Yasuhiko</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Deposition device and deposition method</title><date>2019-06-04</date><risdate>2019</risdate><abstract>A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Deposition device and deposition method |
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