Optical interconnect attach to photonic device with partitioning adhesive function

A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on...

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Hauptverfasser: Barwicz, Tymon, Boyer, Nicolas, Langlois, Richard D, Cyr, Elaine, Fortier, Paul Francis, Janta-Polczynski, Barnim Alexander
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creator Barwicz, Tymon
Boyer, Nicolas
Langlois, Richard D
Cyr, Elaine
Fortier, Paul Francis
Janta-Polczynski, Barnim Alexander
description A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10302869B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10302869B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10302869B13</originalsourceid><addsrcrecordid>eNqNyk0KwkAMQOHZuBD1DvEAQmtBdKso7gR_1iWkaSdQMqET6_VV8ACuHny8abhezIWwB1HngZIqkwO6I0XwBBaTJxWChkchhpd4BMPBxeXj2gE2kbOMDO1T6YvzMGmxz7z4dRaWp-P9cF6xpZqzIbGy149bWVTFervZ7cvqn-cNgZw5DA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Optical interconnect attach to photonic device with partitioning adhesive function</title><source>esp@cenet</source><creator>Barwicz, Tymon ; Boyer, Nicolas ; Langlois, Richard D ; Cyr, Elaine ; Fortier, Paul Francis ; Janta-Polczynski, Barnim Alexander</creator><creatorcontrib>Barwicz, Tymon ; Boyer, Nicolas ; Langlois, Richard D ; Cyr, Elaine ; Fortier, Paul Francis ; Janta-Polczynski, Barnim Alexander</creatorcontrib><description>A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.</description><language>eng</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190528&amp;DB=EPODOC&amp;CC=US&amp;NR=10302869B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190528&amp;DB=EPODOC&amp;CC=US&amp;NR=10302869B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Barwicz, Tymon</creatorcontrib><creatorcontrib>Boyer, Nicolas</creatorcontrib><creatorcontrib>Langlois, Richard D</creatorcontrib><creatorcontrib>Cyr, Elaine</creatorcontrib><creatorcontrib>Fortier, Paul Francis</creatorcontrib><creatorcontrib>Janta-Polczynski, Barnim Alexander</creatorcontrib><title>Optical interconnect attach to photonic device with partitioning adhesive function</title><description>A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyk0KwkAMQOHZuBD1DvEAQmtBdKso7gR_1iWkaSdQMqET6_VV8ACuHny8abhezIWwB1HngZIqkwO6I0XwBBaTJxWChkchhpd4BMPBxeXj2gE2kbOMDO1T6YvzMGmxz7z4dRaWp-P9cF6xpZqzIbGy149bWVTFervZ7cvqn-cNgZw5DA</recordid><startdate>20190528</startdate><enddate>20190528</enddate><creator>Barwicz, Tymon</creator><creator>Boyer, Nicolas</creator><creator>Langlois, Richard D</creator><creator>Cyr, Elaine</creator><creator>Fortier, Paul Francis</creator><creator>Janta-Polczynski, Barnim Alexander</creator><scope>EVB</scope></search><sort><creationdate>20190528</creationdate><title>Optical interconnect attach to photonic device with partitioning adhesive function</title><author>Barwicz, Tymon ; Boyer, Nicolas ; Langlois, Richard D ; Cyr, Elaine ; Fortier, Paul Francis ; Janta-Polczynski, Barnim Alexander</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10302869B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>Barwicz, Tymon</creatorcontrib><creatorcontrib>Boyer, Nicolas</creatorcontrib><creatorcontrib>Langlois, Richard D</creatorcontrib><creatorcontrib>Cyr, Elaine</creatorcontrib><creatorcontrib>Fortier, Paul Francis</creatorcontrib><creatorcontrib>Janta-Polczynski, Barnim Alexander</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Barwicz, Tymon</au><au>Boyer, Nicolas</au><au>Langlois, Richard D</au><au>Cyr, Elaine</au><au>Fortier, Paul Francis</au><au>Janta-Polczynski, Barnim Alexander</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Optical interconnect attach to photonic device with partitioning adhesive function</title><date>2019-05-28</date><risdate>2019</risdate><abstract>A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.</abstract><oa>free_for_read</oa></addata></record>
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subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title Optical interconnect attach to photonic device with partitioning adhesive function
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T04%3A33%3A27IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Barwicz,%20Tymon&rft.date=2019-05-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10302869B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true