Monolithic three-dimensional (3D) ICs with local inter-level interconnects

Monolithic 3D ICs employing one or more local inter-level interconnect integrated intimately with at least one structure of at least one transistor on at least one transistor level within the 3D IC. In certain embodiments the local inter-level interconnect intersects a gate electrode or a source/dra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Morrow, Patrick, Jun, Kimin, Webb, M. Clair, Nelson, Donald W
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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