Substrate processing method, substrate processing apparatus and storage medium

A substrate processing apparatus according to the present disclosure includes: a nozzle that ejects a processing liquid to a wafer; a force-feeding unit that force-feeds the processing liquid to the nozzle side; a liquid feeding pipeline that includes first and second valves and guides the processin...

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Bibliographische Detailangaben
Hauptverfasser: Yoshihara, Kentaro, Watanabe, Masanobu, Nishi, Kouzo, Hatakeyama, Shinichi, Totsuka, Seiya
Format: Patent
Sprache:eng
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