Semiconductor device having semiconductor element bonded to base body by adhesive member

Semiconductor device having semiconductor element bonded to base body by adhesive member

A semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device includes a base body, and a semiconductor element bonded on the base body via an adhesive member. The adhesive member contains surface-trea...

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Hauptverfasser: Tanisada, Tomoki, Imura, Toshifumi, Kuramoto, Masafumi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Tanisada, Tomoki
Imura, Toshifumi
Kuramoto, Masafumi
description A semiconductor device in which wet-spreading of an adhesive member for bonding the semiconductor element on a base body is suppressed. The semiconductor device includes a base body, and a semiconductor element bonded on the base body via an adhesive member. The adhesive member contains surface-treated particles, or particles that coexist with a dispersing agent. At least a part of the marginal portion of the adhesive member is a region where the particles are unevenly distributed.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device having semiconductor element bonded to base body by adhesive member
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