Method, apparatus and system for configuring a protocol stack of an integrated circuit chip
Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Per...
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| creator | Rangaraj, Deepak M Song, Marcus W Wood, Aimee D Spry, Bryan L Ananthakrishnan, Avinash N Hayes, Robert J Letendre, Adam E Boswell, Brent R |
| description | Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information. |
| format | Patent |
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In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190507&DB=EPODOC&CC=US&NR=10282341B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190507&DB=EPODOC&CC=US&NR=10282341B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Rangaraj, Deepak M</creatorcontrib><creatorcontrib>Song, Marcus W</creatorcontrib><creatorcontrib>Wood, Aimee D</creatorcontrib><creatorcontrib>Spry, Bryan L</creatorcontrib><creatorcontrib>Ananthakrishnan, Avinash N</creatorcontrib><creatorcontrib>Hayes, Robert J</creatorcontrib><creatorcontrib>Letendre, Adam E</creatorcontrib><creatorcontrib>Boswell, Brent R</creatorcontrib><title>Method, apparatus and system for configuring a protocol stack of an integrated circuit chip</title><description>Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. 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In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
| title | Method, apparatus and system for configuring a protocol stack of an integrated circuit chip |
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