Semiconductor device having a boundary structure, a package on package structure, and a method of making

The present disclosure relates to a semiconductor device. In some embodiments, the semiconductor device has a first plurality of conductive pads arranged over a first substrate. A conductive solder material is arranged over and is electrically connected to the first plurality of conductive pads. A f...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jang, Bor-Ping, Lin, Yeong-Jyh, Liang, Hsiao-Chung, Hwang, Chien Ling
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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