Packaged semiconductor device and method for forming

A packaged semiconductor device includes a die attached to a die flag of a lead frame wherein the die includes a first, second, third, and fourth minor side, wherein the first and second minor sides are opposite each other and the third and fourth minor sides are opposite each other. The device incl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Higgins, III, Leo M, Carpenter, Burton Jesse
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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