Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same

Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same

Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for cov...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jung, Seoung Ho, Hwang, Sung Ki, Jung, Jung Hwa
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Jung, Seoung Ho
Hwang, Sung Ki
Jung, Jung Hwa
description Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10236421B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10236421B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10236421B23</originalsourceid><addsrcrecordid>eNqNjT0OgkAUhGksjHqHZw-JgPEAGo2FnVqT5zKwG_eHwFvOLxgPYDXJzHwzyyTcTKslgzMixrdUYzQK1LF6c4uUHPvYsJLYz6mD6FCTaPQITUrsaxqhjbIgy677Gq-JtfMqRW-EjFc21jM9sMM6WTRsB2x-ukq2l_PjdM3QhQrD9AsPqZ73fFeUh32RH4vyn84H6zRCyA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same</title><source>esp@cenet</source><creator>Jung, Seoung Ho ; Hwang, Sung Ki ; Jung, Jung Hwa</creator><creatorcontrib>Jung, Seoung Ho ; Hwang, Sung Ki ; Jung, Jung Hwa</creatorcontrib><description>Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190319&amp;DB=EPODOC&amp;CC=US&amp;NR=10236421B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190319&amp;DB=EPODOC&amp;CC=US&amp;NR=10236421B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Jung, Seoung Ho</creatorcontrib><creatorcontrib>Hwang, Sung Ki</creatorcontrib><creatorcontrib>Jung, Jung Hwa</creatorcontrib><title>Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same</title><description>Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjT0OgkAUhGksjHqHZw-JgPEAGo2FnVqT5zKwG_eHwFvOLxgPYDXJzHwzyyTcTKslgzMixrdUYzQK1LF6c4uUHPvYsJLYz6mD6FCTaPQITUrsaxqhjbIgy677Gq-JtfMqRW-EjFc21jM9sMM6WTRsB2x-ukq2l_PjdM3QhQrD9AsPqZ73fFeUh32RH4vyn84H6zRCyA</recordid><startdate>20190319</startdate><enddate>20190319</enddate><creator>Jung, Seoung Ho</creator><creator>Hwang, Sung Ki</creator><creator>Jung, Jung Hwa</creator><scope>EVB</scope></search><sort><creationdate>20190319</creationdate><title>Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same</title><author>Jung, Seoung Ho ; Hwang, Sung Ki ; Jung, Jung Hwa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10236421B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Jung, Seoung Ho</creatorcontrib><creatorcontrib>Hwang, Sung Ki</creatorcontrib><creatorcontrib>Jung, Jung Hwa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Jung, Seoung Ho</au><au>Hwang, Sung Ki</au><au>Jung, Jung Hwa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same</title><date>2019-03-19</date><risdate>2019</risdate><abstract>Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US10236421B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Light-emitting device package, manufacturing method thereof, and vehicle lamp and backlight unit including same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-17T18%3A14%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Jung,%20Seoung%20Ho&rft.date=2019-03-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10236421B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true