Semiconductor device

A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Nakamura, Shingo, Kumagaya, Yoshikazu, Matsubara, Hiroaki, Miyakoshi, Takeshi, Sakumoto, Shotaro, Hosoyamada, Sumikazu, Chikai, Tomoshige
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Nakamura, Shingo
Kumagaya, Yoshikazu
Matsubara, Hiroaki
Miyakoshi, Takeshi
Sakumoto, Shotaro
Hosoyamada, Sumikazu
Chikai, Tomoshige
description A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10236231B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10236231B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10236231B23</originalsourceid><addsrcrecordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGRsZmRsaGTkbGxKgBAGFbIQI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Semiconductor device</title><source>esp@cenet</source><creator>Nakamura, Shingo ; Kumagaya, Yoshikazu ; Matsubara, Hiroaki ; Miyakoshi, Takeshi ; Sakumoto, Shotaro ; Hosoyamada, Sumikazu ; Chikai, Tomoshige</creator><creatorcontrib>Nakamura, Shingo ; Kumagaya, Yoshikazu ; Matsubara, Hiroaki ; Miyakoshi, Takeshi ; Sakumoto, Shotaro ; Hosoyamada, Sumikazu ; Chikai, Tomoshige</creatorcontrib><description>A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190319&amp;DB=EPODOC&amp;CC=US&amp;NR=10236231B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190319&amp;DB=EPODOC&amp;CC=US&amp;NR=10236231B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Nakamura, Shingo</creatorcontrib><creatorcontrib>Kumagaya, Yoshikazu</creatorcontrib><creatorcontrib>Matsubara, Hiroaki</creatorcontrib><creatorcontrib>Miyakoshi, Takeshi</creatorcontrib><creatorcontrib>Sakumoto, Shotaro</creatorcontrib><creatorcontrib>Hosoyamada, Sumikazu</creatorcontrib><creatorcontrib>Chikai, Tomoshige</creatorcontrib><title>Semiconductor device</title><description>A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJTs3NTM7PSylNLskvUkhJLctMTuVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYYGRsZmRsaGTkbGxKgBAGFbIQI</recordid><startdate>20190319</startdate><enddate>20190319</enddate><creator>Nakamura, Shingo</creator><creator>Kumagaya, Yoshikazu</creator><creator>Matsubara, Hiroaki</creator><creator>Miyakoshi, Takeshi</creator><creator>Sakumoto, Shotaro</creator><creator>Hosoyamada, Sumikazu</creator><creator>Chikai, Tomoshige</creator><scope>EVB</scope></search><sort><creationdate>20190319</creationdate><title>Semiconductor device</title><author>Nakamura, Shingo ; Kumagaya, Yoshikazu ; Matsubara, Hiroaki ; Miyakoshi, Takeshi ; Sakumoto, Shotaro ; Hosoyamada, Sumikazu ; Chikai, Tomoshige</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10236231B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Nakamura, Shingo</creatorcontrib><creatorcontrib>Kumagaya, Yoshikazu</creatorcontrib><creatorcontrib>Matsubara, Hiroaki</creatorcontrib><creatorcontrib>Miyakoshi, Takeshi</creatorcontrib><creatorcontrib>Sakumoto, Shotaro</creatorcontrib><creatorcontrib>Hosoyamada, Sumikazu</creatorcontrib><creatorcontrib>Chikai, Tomoshige</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Nakamura, Shingo</au><au>Kumagaya, Yoshikazu</au><au>Matsubara, Hiroaki</au><au>Miyakoshi, Takeshi</au><au>Sakumoto, Shotaro</au><au>Hosoyamada, Sumikazu</au><au>Chikai, Tomoshige</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor device</title><date>2019-03-19</date><risdate>2019</risdate><abstract>A semiconductor device includes a lead frame; a circuit board located on the lead frame; a power device that includes a switching element and is mounted on the circuit board via a bump located between the power device and the circuit board; and a heat releasing member connected to the power device. The circuit board may be a multi-layer wiring board. The circuit board may include a capacitor element, a resistor element, an inductor element, a diode element and a switching element.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US10236231B2
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Semiconductor device
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T16%3A37%3A43IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Nakamura,%20Shingo&rft.date=2019-03-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS10236231B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true