UV curable interlayer for electronic printing
UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25° C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, pol...
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| creator | Song, Guiqin Hu, Nan-Xing Chopra, Naveen Breton, Marcel P |
| description | UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25° C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one(meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10° C. to about 100° C. and a dynamic viscosity at 25° C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US10233332B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US10233332B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US10233332B23</originalsourceid><addsrcrecordid>eNrjZNANDVNILi1KTMpJVcjMK0ktykmsTC1SSMsvUkjNSU0uKcrPy0xWKCgCymXmpfMwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDI2MgMHIyMiZGDQDVWips</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>UV curable interlayer for electronic printing</title><source>esp@cenet</source><creator>Song, Guiqin ; Hu, Nan-Xing ; Chopra, Naveen ; Breton, Marcel P</creator><creatorcontrib>Song, Guiqin ; Hu, Nan-Xing ; Chopra, Naveen ; Breton, Marcel P</creatorcontrib><description>UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25° C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one(meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10° C. to about 100° C. and a dynamic viscosity at 25° C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided.</description><language>eng</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INKS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; PRINTED CIRCUITS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190319&DB=EPODOC&CC=US&NR=10233332B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190319&DB=EPODOC&CC=US&NR=10233332B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Song, Guiqin</creatorcontrib><creatorcontrib>Hu, Nan-Xing</creatorcontrib><creatorcontrib>Chopra, Naveen</creatorcontrib><creatorcontrib>Breton, Marcel P</creatorcontrib><title>UV curable interlayer for electronic printing</title><description>UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25° C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one(meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10° C. to about 100° C. and a dynamic viscosity at 25° C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INKS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANDVNILi1KTMpJVcjMK0ktykmsTC1SSMsvUkjNSU0uKcrPy0xWKCgCymXmpfMwsKYl5hSn8kJpbgZFN9cQZw_d1IL8-NTigsTk1LzUkvjQYEMDI2MgMHIyMiZGDQDVWips</recordid><startdate>20190319</startdate><enddate>20190319</enddate><creator>Song, Guiqin</creator><creator>Hu, Nan-Xing</creator><creator>Chopra, Naveen</creator><creator>Breton, Marcel P</creator><scope>EVB</scope></search><sort><creationdate>20190319</creationdate><title>UV curable interlayer for electronic printing</title><author>Song, Guiqin ; Hu, Nan-Xing ; Chopra, Naveen ; Breton, Marcel P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10233332B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INKS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Song, Guiqin</creatorcontrib><creatorcontrib>Hu, Nan-Xing</creatorcontrib><creatorcontrib>Chopra, Naveen</creatorcontrib><creatorcontrib>Breton, Marcel P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Song, Guiqin</au><au>Hu, Nan-Xing</au><au>Chopra, Naveen</au><au>Breton, Marcel P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>UV curable interlayer for electronic printing</title><date>2019-03-19</date><risdate>2019</risdate><abstract>UV-curable interlayer compositions are provided. In embodiments, the interlayer composition comprises at least one aliphatic di(meth)acrylate monomer diluent having a dynamic viscosity at 25° C. of less than about 100 cps; at least one (meth)acrylate oligomer selected from epoxy (meth)acrylates, polyester (meth)acrylates, polyether (meth)acrylates, urethane (meth)acrylates and combinations thereof, the at least one(meth) acrylate oligomer having a glass transition temperature in the range of from about minus 10° C. to about 100° C. and a dynamic viscosity at 25° C. of less than about 3000 cps; and at least two photoinitiators. Multilayer structures formed using the compositions and related methods are also provided.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
| title | UV curable interlayer for electronic printing |
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