Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds
A first composition (A) contains (i) at least one compound (I) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (I) is preferably triallyl isocyanurate, and (ii) at least one bis(alkenylamide) compound. A second composition (B) contains the fi...
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| creator | Schauhoff, Stephanie Ulbricht, Daniel Ohlemacher, Juergen Kleff, Frank Hein, Marcel |
| description | A first composition (A) contains (i) at least one compound (I) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (I) is preferably triallyl isocyanurate, and (ii) at least one bis(alkenylamide) compound. A second composition (B) contains the first composition (A) and at least one polyolefin copolymer. The composition (B) is used for the production of a film for encapsulation of an electronic device, especially a solar cell. |
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A second composition (B) contains the first composition (A) and at least one polyolefin copolymer. The composition (B) is used for the production of a film for encapsulation of an electronic device, especially a solar cell.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190319&DB=EPODOC&CC=US&NR=10233275B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190319&DB=EPODOC&CC=US&NR=10233275B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schauhoff, Stephanie</creatorcontrib><creatorcontrib>Ulbricht, Daniel</creatorcontrib><creatorcontrib>Ohlemacher, Juergen</creatorcontrib><creatorcontrib>Kleff, Frank</creatorcontrib><creatorcontrib>Hein, Marcel</creatorcontrib><title>Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds</title><description>A first composition (A) contains (i) at least one compound (I) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (I) is preferably triallyl isocyanurate, and (ii) at least one bis(alkenylamide) compound. 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The composition (B) is used for the production of a film for encapsulation of an electronic device, especially a solar cell.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwjAUALM4iPoPcdOhoAni3qLoXDuXkL6U0OS9kJcO_XtF_ACng7tbi66hymZiDh4nyJIXLhBZOsoS0JrEczDFE0rnw8dbiil79jjK-tkeTJgAl2CiH-D4jTTjwFuxciYw7H7ciP399moeFSTqgZOxgFD6rj2flNbqeqmV_ud5AzhUOe4</recordid><startdate>20190319</startdate><enddate>20190319</enddate><creator>Schauhoff, Stephanie</creator><creator>Ulbricht, Daniel</creator><creator>Ohlemacher, Juergen</creator><creator>Kleff, Frank</creator><creator>Hein, Marcel</creator><scope>EVB</scope></search><sort><creationdate>20190319</creationdate><title>Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds</title><author>Schauhoff, Stephanie ; Ulbricht, Daniel ; Ohlemacher, Juergen ; Kleff, Frank ; Hein, Marcel</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10233275B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>Schauhoff, Stephanie</creatorcontrib><creatorcontrib>Ulbricht, Daniel</creatorcontrib><creatorcontrib>Ohlemacher, Juergen</creatorcontrib><creatorcontrib>Kleff, Frank</creatorcontrib><creatorcontrib>Hein, Marcel</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Schauhoff, Stephanie</au><au>Ulbricht, Daniel</au><au>Ohlemacher, Juergen</au><au>Kleff, Frank</au><au>Hein, Marcel</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds</title><date>2019-03-19</date><risdate>2019</risdate><abstract>A first composition (A) contains (i) at least one compound (I) selected from the group consisting of triallyl isocyanurate, and triallyl cyanurate, wherein the compound (I) is preferably triallyl isocyanurate, and (ii) at least one bis(alkenylamide) compound. 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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | Co-crosslinker systems for encapsulation films comprising BIS(alkenylamide) compounds |
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