Three-dimensional optical path with 1×m output ports using SOI-based vertically-splitting waveguides

A three dimensional optical interconnect device having one input and multiple output ports mounted on the same surface of a SOI wafer is disclosed. The first Si surface has a silicon waveguide with a straight portion, a first and a second 45 degree end reflectors and multiple optical splitters arran...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jou, Abraham, Wu, Paul Mao-Jen
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!